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    XFP 30Pos SMD Connector : RE-C-XFP-01

    Series Part No: RE-C-XFP-01
    RoHS Compliance: Yes
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    Specifications Description Reviews
    Features:
    Capable of 10Gbps data signal speeds 15 or 30-microinch gold plating. 
    High-speed contact design. 
    SMT design in tape reel or tray packaging. 
    Advanced stamping technology for smooth contact surface.
    Material：
    Insulators：Polyester Thermoplastics Glass Fibre Filled, UL 94V-0 
    Contact：Copper Alloy With Au Plated.
    Electrical：
    Contact Resistance：△R10 milliohms Max. for signal contacts 
    Insulation Resistance：1000MΩ Min. Current Rating：0.5 Amps Max. per contact
    Mechanical：
    Transceiver Insertion Force：40N Max. 
    Transceiver Extraction Force：30N Max. 
    Durability：100 Cycles Min. 
    Operating Temperature Range：-20°C to +85°C

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    XFP 30Pos SMD Connector : RE-C-XFP-01